ChemOptics supplies electronic materials for semiconductor and devices
for optical communication for future advanced industries.
We also provide foundry services to support R&D
and process validation for photonic semiconductor technologies.
Building on our accumulated expertise in post-PIC module assembly and packaging processes, ChemOptics delivers customized solutions for optical communication devices and waveguide modules to meet diverse customer needs.
Provides optical device-related foundry services such as polymer optical waveguide design-manufacturing, photolithography/etching/metalization(4-inch wafer), wafer dicing/polishing, wire bonding, optical alignment, and packaging/module/reliability test.
SEM images of ICP etched polymer waveguide
Sputter
E-beam evaporator
Au Plating machine
Au Plating machine and Loading JIG and Plating Process
Pad Au plating
Au wire ball
Non-contact 3D profiler
Non-contact 3D profiler image processing for grating pattern
α-step
Dicing Machine
Wafer
Chip Bar
Polishing & Lapping Equipment
Loading JIG (0, 8˚)
Lapping/Polishing Surface
Wire Bonder (Auto/Manual)
Pulling Test System
Auto-alignment system
Lateral alignment for PLC
Vertical alignment
TEC temp. control package
We possess a wide range of equipment for aligning, modulation, packaging, evaluation and development of optical communication devices and waveguide modules. This enables you to use equipment, research, and feasibility test.
Service Request:sales@chemoptics.co.kr
| Equipment | Maker | Model | Number of Equipment |
|---|---|---|---|
| ICP (Induced Coupled Plasma) |
Plasma Therm etc. | Takachi SLR ICP5 | 4 |
| E-BEAM | AMS | AED 0404-CD | 2 |
| Sputter | HANA | H-100S/2005 | 2 |
| Electroplating | SUNGWON FORMING | - | - |
| Wet Station (Polymer, Organic, Acid) |
LTS etc. | LT-SS-200-MC | 3 |
| Spin Dryer | Jaesung Engineering | JS201 | - |
| UV Curing | UV Systec | UV-CB-3X1-ST etc. | 4 |
| TRACK M/C (Coater,Developer,Baker) |
Silicon Tech LTS |
- LT-AS-150-SCD |
- |
| Spin Coater | SussMicro Tec | Labspin 6 | - |
| Developer | SussMicro Tec | RC8 MS3 | - |
| Mask Aligner | SussMicro Tec | MA6 | - |
| Measurement Equipment | - | 3D Thickness, Contact Angle Waveguide Shape Measurement etc. |
- |
| Experimental Equipment | - | Dry Oven, Hot Plate | - |
| PCT | FIBERPRO etc. | IFA-6005 etc. | 5 |
| Chip Bar | FIBERPRO | FA6000 | - |
| Dicing Saw Machine | NEON TECH | NEON 6010 | 2 |
| Polishing Machine | Logitech | 65-010-01 etc. | 3 |
| Reliability Test Equipment | - | Cycling Chamber, Aging, Wire Bonder, Laser Welder etc. |
- |
| Others | - | Splicer, Tape Mounter Butt Coupling, Splicer |
- |